Nano-Master Reactive Ion Etch (RIE) Plasma System

Nano-master NPC 3000 is a bench-top Reactive Ion Etching (RIE) system with showerhead gas distribution and water cooled RF platen. It is designed to meet a wide range of needs including sample cleaning, photoresist stripping, surface modification, polymer etching and silicon etching. The chamber opens from the top for wafer loading or unloading. It can accept up to 8" (200 mm) wafers Comparison of the RIE systems available in the MRL shared research facilities: Substrates (e.g., Si, Glass, etc.), 2D Transition-metal dichalcogenides, dielectrics (metal oxides, nitrides, etc.) (*) Discuss with staff before actually using any of those materials and if other materials are needed in the process. This is required for new and existing experienced users. (**) Etching rate and quality will depend on several factors (type of material, sample thickness, pattern details, masking parameters, etc.). A discussion with staff is important in order to decide tool assignment and feasibility. Manufacturer's website: http://www.nanomaster.com/plasmaashing.html