pcb lamination
LPKF MultiPress S PCB Laminating System
By LPKF - MultiPress S (2025)
University of Massachusetts Amherst
0.0(0 reviews)
Multi-layer PCB laminating system for bonding multiple printed circuit board layers together. Features 9" x 12" laminating area with capability to process up to 8 layers simultaneously. Essential for creating complex multilayer PCB prototypes with proper layer adhesion and electrical isolation.
Min. Booking: 1 hours
Download App to Book
Enterprise or contract research?